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1 data sheet acquired from harris semiconductor schs118c features buffered inputs typical propagation delay: 7ns at v cc = 5v, c l = 15pf, t a = 25 o c fanout (over temperature range) - standard outputs . . . . . . . . . . . . . . . 10 lsttl loads - bus driver outputs . . . . . . . . . . . . . 15 lsttl loads wide operating temperature range . . . -55 o c to 125 o c balanced propagation delay and transition times signi?ant power reduction compared to lsttl logic ics hc types - 2v to 6v operation - high noise immunity: n il = 30%, n ih = 30% of v cc at v cc = 5v hct types - 4.5v to 5.5v operation - direct lsttl input logic compatibility, v il = 0.8v (max), v ih = 2v (min) cmos input compatibility, i l 1 a at v ol , v oh description the cd54hc08, cd54hct08, cd74hc08, and cd74hct08 logic gates utilize silicon gate cmos technology to achieve operating speeds similar to lsttl gates with the low power consumption of standard cmos integrated circuits. all devices have the ability to drive 10 lsttl loads. the 74hct logic family is functionally pin compatible with the standard 74ls logic family. ordering information part number temp. range ( o c) package cd54hc08f3a -55 to 125 14 ld cerdip CD54HCT08F3A -55 to 125 14 ld cerdip cd74hc08e -55 to 125 14 ld pdip cd74hc08m -55 to 125 14 ld soic cd74hc08mt -55 to 125 14 ld soic cd74hc08m96 -55 to 125 14 ld soic cd74hc08pw -55 to 125 14 ld tssop cd74hc08pwr -55 to 125 14 ld tssop cd74hct08e -55 to 125 14 ld pdip cd74hct08m -55 to 125 14 ld soic cd74hct08mt -55 to 125 14 ld soic cd74hct08m96 -55 to 125 14 ld soic note: when ordering, use the entire part number. the suf? 96 denotes tape and reel. the suf? t denotes a small-quantity reel of 250. august 1997 - revised july 2004 caution: these devices are sensitive to electrostatic discharge. users should follow proper ic handling procedures. copyright 2004, texas instruments incorporated cd54hc08, cd74hc08, cd54hct08, cd74hct08 high-speed cmos logic quad 2-input and gate [ /title ( cd54h c 08, c d54h c t08, c d74h c 08, c d74h c t08) / sub- j ect ( high
2 pinout cd54hc08, cd54hct08, (cerdip) cd74hc08 (pdip, soic, tssop) cd74hct08 (pdip, soic) top view functional diagram truth table inputs output na nb ny lll lhl hll hhh h = high voltage level, l = low voltage level 1a 1b 1y 2a 2b 2y gnd v cc 4b 4a 4y 3b 3a 3y 1 2 3 4 5 6 7 14 13 12 11 10 9 8 1a 1b 2a 2b 2y gnd 1 2 3 4 5 6 14 13 12 11 v cc 4y 3y 3b 4a 4b 10 8 7 9 3a 1y cd54hc08, cd74hc08, cd54hct08, cd74hct08
3 hc logic symbol hct logic symbol na nb ny na nb ny cd54hc08, cd74hc08, cd54hct08, cd74hct08
4 absolute maximum ratings thermal information dc supply voltage, v cc . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to 7v dc input diode current, i ik for v i < -0.5v or v i > v cc + 0.5v . . . . . . . . . . . . . . . . . . . . . . 20ma dc output diode current, i ok for v o < -0.5v or v o > v cc + 0.5v . . . . . . . . . . . . . . . . . . . . 20ma dc output source or sink current per output pin, i o for v o > -0.5v or v o < v cc + 0.5v . . . . . . . . . . . . . . . . . . . . 25ma dc v cc or ground current, i cc or i gnd . . . . . . . . . . . . . . . . . . 50ma operating conditions temperature range (t a ) . . . . . . . . . . . . . . . . . . . . . -55 o c to 125 o c supply voltage range, v cc hc types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2v to 6v hct types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5v to 5.5v dc input or output voltage, v i , v o . . . . . . . . . . . . . . . . . 0v to v cc input rise and fall time 2v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (max) 4.5v. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (max) 6v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (max) thermal resistance (typical, note 1) ja ( o c/w) e (pdip) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 m (soic) package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 pw (tssop) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 maximum junction temperature (hermetic package or die) . . . 175 o c maximum junction temperature (plastic package) . . . . . . . . 150 o c maximum storage temperature range . . . . . . . . . .-65 o c to 150 o c maximum lead temperature (soldering 10s) . . . . . . . . . . . . . 300 o c (soic - lead tips only) caution: stresses above those listed in ?bsolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operatio n of the device at these or any other conditions above those indicated in the operational sections of this speci?ation is not im plied. note: 1. the package thermal impedance is calculated in accordance with jesd 51-7. dc electrical speci?ations parameter symbol test conditions v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c units v i (v) i o (ma) min typ max min max min max hc types high level input voltage v ih - - 2 1.5 - - 1.5 - 1.5 - v 4.5 3.15 - - 3.15 - 3.15 - v 6 4.2 - - 4.2 - 4.2 - v low level input voltage v il - - 2 - - 0.5 - 0.5 - 0.5 v 4.5 - - 1.35 - 1.35 - 1.35 v 6 - - 1.8 - 1.8 - 1.8 v high level output voltage cmos loads v oh v ih or v il -0.02 2 1.9 - - 1.9 - 1.9 - v -0.02 4.5 4.4 - - 4.4 - 4.4 - v -0.02 6 5.9 - - 5.9 - 5.9 - v high level output voltage ttl loads ---------v -4 4.5 3.98 - - 3.84 - 3.7 - v -5.2 6 5.48 - - 5.34 - 5.2 - v low level output voltage cmos loads v ol v ih or v il 0.02 2 - - 0.1 - 0.1 - 0.1 v 0.02 4.5 - - 0.1 - 0.1 - 0.1 v 0.02 6 - - 0.1 - 0.1 - 0.1 v low level output voltage ttl loads ---------v 4 4.5 - - 0.26 - 0.33 - 0.4 v 5.2 6 - - 0.26 - 0.33 - 0.4 v input leakage current i i v cc or gnd -6-- 0.1 - 1- 1 a cd54hc08, cd74hc08, cd54hct08, cd74hct08
5 quiescent device current i cc v cc or gnd 0 6 - - 2 - 20 - 40 a hct types high level input voltage v ih - - 4.5 to 5.5 2- - 2 - 2 - v low level input voltage v il - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 v high level output voltage cmos loads v oh v ih or v il -0.02 4.5 4.4 - - 4.4 - 4.4 - v high level output voltage ttl loads -4 4.5 3.98 - - 3.84 - 3.7 - v low level output voltage cmos loads v ol v ih or v il 0.02 4.5 - - 0.1 - 0.1 - 0.1 v low level output voltage ttl loads 4 4.5 - - 0.26 - 0.33 - 0.4 v input leakage current i i v cc and gnd 0 5.5 - 0.1 - 1- 1 a quiescent device current i cc v cc or gnd 0 5.5 - - 2 - 20 - 40 a additional quiescent device current per input pin: 1 unit load ? i cc (note 2) v cc - 2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 a note: 2. for dual-supply systems theoretical worst case (v i = 2.4v, v cc = 5.5v) specification is 1.8ma. dc electrical speci?ations (continued) parameter symbol test conditions v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c units v i (v) i o (ma) min typ max min max min max hct input loading table input unit loads all 0.6 note: unit load is ? i cc limit speci?d in dc electrical speci?ations table, e.g. 360 a max at 25 o c. switching speci?ations input t r , t f = 6ns parameter symbol test conditions v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c units min typ max min max min max hc types propagation delay, input to output (figure 1) t plh , t phl c l = 50pf 2 - - 90 - 115 - 135 ns 4.5 - - 18 - 23 - 27 ns 6 - - 15 - 20 - 23 ns propagation delay, data input to output y t plh , t phl c l = 15pf 5 - 7 - ----ns cd54hc08, cd74hc08, cd54hct08, cd74hct08
6 transition times (figure 1) t tlh , t thl c l = 50pf 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns input capacitance c i - - - - 10 - 10 - 10 pf power dissipation capacitance (notes 3, 4) c pd - 5-37-----pf hct types propagation delay, input to output y (figure 2) t plh , t phl c l = 50pf 4.5 - - 25 - 31 - 38 ns propagation delay, data input to output y t plh , t phl c l = 15pf 5 - 10 - ----ns transition times (figure 2) t tlh , t thl c l = 50pf 4.5 - - 15 - 19 - 22 ns input capacitance c i c l = 50pf - - - 10 - 10 - 10 pf power dissipation capacitance (notes 3, 4) c pd - 5-51-----pf notes: 3. c pd is used to determine the dynamic power consumption, per gate. 4. p d = v cc 2 f i (c pd + c l ) where f i = input frequency, c l = output load capacitance, v cc = supply voltage. switching speci?ations input t r , t f = 6ns (continued) parameter symbol test conditions v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c units min typ max min max min max test circuits and waveforms figure 3. hc and hcu transition times and propaga- tion delay times, combination logic figure 4. hct transition times and propagation delay times, combination logic t phl t plh t thl t tlh 90% 50% 10% 50% 10% inverting output input gnd v cc t r = 6ns t f = 6ns 90% t phl t plh t thl t tlh 2.7v 1.3v 0.3v 1.3v 10% inverting output input gnd 3v t r = 6ns t f = 6ns 90%
package option addendum www.ti.com 5-sep-2011 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ ball finish msl peak temp (3) samples (requires login) 5962-8688301ca active cdip j 14 1 tbd call ti call ti cd54hc08f active cdip j 14 1 tbd a42 n / a for pkg type cd54hc08f3a active cdip j 14 1 tbd a42 n / a for pkg type cd54hct08f active cdip j 14 1 tbd a42 n / a for pkg type CD54HCT08F3A active cdip j 14 1 tbd a42 n / a for pkg type cd74hc08e active pdip n 14 25 pb-free (rohs) cu nipdau n / a for pkg type cd74hc08ee4 active pdip n 14 25 pb-free (rohs) cu nipdau n / a for pkg type cd74hc08m active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc08m96 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc08m96e4 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc08m96g4 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc08me4 active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc08mg4 active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc08mt active soic d 14 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc08mte4 active soic d 14 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc08mtg4 active soic d 14 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc08pw active tssop pw 14 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc08pwe4 active tssop pw 14 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc08pwg4 active tssop pw 14 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc08pwr active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim
package option addendum www.ti.com 5-sep-2011 addendum-page 2 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ ball finish msl peak temp (3) samples (requires login) cd74hc08pwre4 active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc08pwrg4 active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct08e active pdip n 14 25 pb-free (rohs) cu nipdau n / a for pkg type cd74hct08ee4 active pdip n 14 25 pb-free (rohs) cu nipdau n / a for pkg type cd74hct08m active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct08m96 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct08m96e4 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct08m96g4 active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct08me4 active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct08mg4 active soic d 14 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct08mt active soic d 14 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct08mte4 active soic d 14 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct08mtg4 active soic d 14 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes.
package option addendum www.ti.com 5-sep-2011 addendum-page 3 pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of cd54hc08, cd54hct08, cd74hc08, cd74hct08 : ? catalog: cd74hc08 , cd74hct08 ? automotive: cd74hc08-q1 , cd74hc08-q1 ? enhanced product: cd74hc08-ep , cd74hc08-ep ? military: cd54hc08 , cd54hct08 note: qualified version definitions: ? catalog - ti's standard catalog product ? automotive - q100 devices qualified for high-reliability automotive applications targeting zero defects ? enhanced product - supports defense, aerospace and medical applications ? military - qml certified for military and defense applications
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant cd74hc08m96 soic d 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 q1 cd74hc08mt soic d 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 q1 cd74hc08pwr tssop pw 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 cd74hct08m96 soic d 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 q1 cd74hct08mt soic d 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 q1 package materials information www.ti.com 14-jul-2012 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) cd74hc08m96 soic d 14 2500 367.0 367.0 38.0 cd74hc08mt soic d 14 250 367.0 367.0 38.0 cd74hc08pwr tssop pw 14 2000 367.0 367.0 35.0 cd74hct08m96 soic d 14 2500 367.0 367.0 38.0 cd74hct08mt soic d 14 250 367.0 367.0 38.0 package materials information www.ti.com 14-jul-2012 pack materials-page 2

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